Flip-chip bonding on 6-μm pitch using thin-film microspring technology

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 325-329

  Smith, D L ^a   Fork, D K ^a   Thornton, R L ^a   Alimonda, A S ^a   Chua, C L ^a   Dunnrowicz, C ^a   Ho, J ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MULTICHIP MODULES; NETWORK COMPONENTS; SOLDERING; THERMAL FATIGUE; FATIGUE OF MATERIALS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; LITHOGRAPHY; STRESS CONCENTRATION; THERMAL EFFECTS;

CANTILEVER SPRINGS; FINE-PITCH CAPABILITY; FLIP CHIP BONDING; HIGH COMPLIANCES; INTERCONNECT TECHNOLOGY; THERMAL CONDUCTANCE; THERMAL MISMATCH; TIME TO CONTACT;

FLIP CHIP DEVICES; ELECTRONICS PACKAGING;

THIN FILM MICROSPRING TECHNOLOGY;

EID: 0031633080     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678714     Document Type: Conference Paper

References (5)

1. Lau, J. H., ed., Flip-Chip Technologies. McGraw-Hill (New York, 1996).
2. Smith, D. L., A. S. Alimonda, "A New Flip-Chip Technology for High-Density Packaging", Proc 46th Electronic Components and Technology Conf. (Orlando, Florida, May 1996), pp. 1069-1073.
3. Smith, D. L., A. S. Alimonda, "Photolithographically Patterned Spring Contact", U. S. Patent #5, 613, 861 (1997). [Other patents pending.[
4. Beale, J., R. F. Pease, "Limits of High-Density, Low-Force Pressure Contacts", IEEE Trans-CPMT-A, Vol. 17, No. 2 (1994), pp. 257-262.
5. Chua, C. L., R. L. Thornton, D. W. Treat, "Planar Laterally Oxidized Vertical-Cavity Lasers for Low-Threshold High-Density Top-Surface-Emitting Arrays", IEEE Photon. Technol. Lett, Vol. 9, No. 8 (1997), pp. 1060-1062.