Error analysis of the phase-shifting technique when applied to shadow moiré

Applied Optics

Volumn 45, Issue 6, 2006, Pages 1124-1133

  Han, Changwoon ^a   Han, Bongtae ^b  

^a Korea Electronic Technology Institute (KETI)   (South Korea)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFRACTION GRATINGS; ERROR ANALYSIS; LIGHT SOURCES; NUMERICAL METHODS; OPTICAL RESOLVING POWER; SPECTRUM ANALYSIS;

FRACTIONAL FRINGES; PHASE-SHIFTING TECHNIQUES; RESOLUTION ENHANCEMENT;

PHASE SHIFT;

EID: 33645509762     PISSN: 1559128X     EISSN: 15394522     Source Type: Journal    
DOI: 10.1364/AO.45.001124     Document Type: Article

References (26)

1. K. Creath, "Phase-measurement interferometry techniques," in Progress in Optics, E. Wolf, ed. (North-Holland, 1988), Vol. 26, pp. 349-393.
2. J. E. A. Liao and A. S. Voloshin, "Enhancement of the shadow-moiré method through digital image processing," Exper. Mech. 33, 59-63 (1993).
3. Y. Wang and P. Hassell, "Measurement of thermally induced warpage of BGA packages/substrates using phase-stepping shadow moiré," in Proceedings of the 1997 1st Electronic Packaging Technology Conference (IEEE, 1997), pp. 283-289.
4. G. J. Petriccione and I. C. Ume, "Warpage studies of HDI test vehicles during various thermal profiling," IEEE Trans. Advanced Packag. 22, 624-637 (1999).
5. J. C. L. Wu, H. Shine, S. Wu, M. Hung, and J. J. Lee, "Study of rapid cure BGA mold compound on warpage with shadow moiré," in 1999 Proceedings of 49th Electronic Components and Technology Conference (IEEE, 1999), pp. 708-713.
6. Y. Polsky, W. Sutherlin, and I. C. Ume, "A comparison of PWB warpage due to simulated infrared and wave soldering processes," IEEE Trans. Electron. Packag. Manuf. 23, 191-199 (2000).
7. A. X. H. Dang, I. C. Ume, and S. K. Bhattacharya, "Process induced warpage in multitiled alumina substrates for large area MCM-D processing," IEEE Trans. Advanced Packag. 23, 436-445 (2000).
8. R. C. Dunne and S. K. Sitaraman, "An integrated process modeling methodology and module for sequential multilayered substrate fabrication using a coupled cure-thermal-stress analysis approach," IEEE Trans. Electron. Packag. Manuf. 25, 326-334 (2002).
9. I. D. Vrinceanu and S. Danyluk, "Measurement of residual stress in single crystal silicon wafers," in Proceedings of 8th International Symposium on Advanced Packaging Materials (IEEE, 2002), pp. 297-301.
10. J. Zhang, H. Ding, D. F. Baldwin, and I. C. Ume, "Characterization of in-process substrate warpage of underfilled flip chip assembly," in 2003 IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (IEEE, 2003), pp. 291-297.
11. K. Chen, T. Y. F. Chen, C. C. Chuang, and I. K. Lin, "Full-field wafer level thin film stress measurement by phase-stepping shadow moiré," IEEE Tran. Components Packag. Technol. 27, 594-601 (2004).
12. D. Zwemer, M. Bajaj, R. Peak, T. Thurman, K. Brady, S. Mc-Carron, A. Spradling, M. Dickerson, L. Klein, G. Liutkus, and J. Messina, "PWB warpage analysis and verification using an AP210 standards-based engineering framework and shadow moiré," Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (IEEE, 2004), pp. 121-131.
13. Y. Arai and S. Yokozeki, "Improvement of measurement accuracy in shadow moiré by considering the influence of harmonics in the moiré profile," Appl. Opt. 38, 3503-3507 (1999).
14. A. Asundi and C. S. Chan, "Phase shifting applied to nonsinusoidal intensity distribution: an error simulation," Opt. Lasers Eng. 21, 3-30 (1994).
15. K. Patorski, "The self-imaging phenomenon and its applications," in Progress in Optics, E. Wolf, ed. (North-Holland, 1989), Vol. 27, pp. 1-108.
16. E. Keren and O. Kafri, "Diffraction effects in moiré deflectometry," J. Opt. Soc. Am. A 2, 111-120 (1985).
17. M. Testorf, J. Jahns, N. Khilo, and A. Goncharenko, "Talbot effect for oblique angle of light propagation," Opt. Commun. 129, 167-172 (1996).
18. R. F. Edgar, "The Fresnel diffraction images of periodic structures," Opt. Acta 16, 281-287 (1969).
19. C. Han and B. Han, "Contrast of shadow moiré at high-order Talbot distances," Opt. Eng. 44, 28002 (2005).
20. C. Han, "Shadow moiré using non-zero Talbot distance and application of diffraction theory to moiré interferometry," Ph.D. dissertation (University of Maryland, College Park, 2005).
21. D. Post, B. Han, and P. Ifju, "Geometric moiré," in High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials (Springer-Verlag, 1994), Chap. 3.
22. J. B. Allen and D. M. Meadows, "Removal of unwanted patterns from moiré contour maps by grid translation techniques," Appl. Opt. 10, 210-212 (1971).
23. M. Halioua, R. S. Krishnamurthy, H. Liu, and F. P. Chiang, "Projection moiré with moving gratings for automated 3-D topography," Appl. Opt. 22, 850-855 (1983).
24. J. Janssens, W. F. Decraemer, and V. J. Vanhuyse, "Visibility depth of shadow-moiré fringes in function of extend of light source and aperture of recording system," Optik 71, 45-51 (1985).
25. H. M. Ladak, W. F. Decraemer, J. J. J. Dirckx, and W. R. J. Funnell, "Systematic errors in small deformations measured by use of shadow-moiré topography," Appl. Opt. 39, 3266-3275 (2000).
26. O. Kafri and E. Keren, "Fringe observation and depth of field in moiré analysis," Appl. Opt. 20, 2885-2886 (1981).