A comparison of pwb warpage due to simulated infrared and wave soldering processes

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 3, 2000, Pages 191-199

  Polsky, Yarom ^a   Sutherlin, Walter ^b   Charles Ume, I ^b  

^a MDI Inc   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Infrared; Out of plane displacement; Printed wiring boards; Reflow profiles; Test vehicles

Indexed keywords

SOLDERING; TESTING;

REFLOW PROFILES;

PRINTED CIRCUIT BOARDS;

EID: 0034219497     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.873247     Document Type: Article

References (12)

1. l J. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing. New York: McGraw-Hill, 1996, pp. 4-6.
2. Y. Guo Application of shadow Moiré method in electronic packaging," mProc. 1995 SEM Spring Conf. Exhibit, Grand Rapids, MI, June 12-14, 1995.
3. C. Fu and C. Ume Characterizing the temperature dependence of electronic packaging material properties," J. Metals, vol. 47, no. 6, pp. 31-35,June 1995.
4. Y Guo Application of shadow Moiré method in electronic packaging," mProc. 1995 SEM Spring Conf. Exhibit, Grand Rapids, MI, June 12-14, 1995.
5. A. Kobayashi, Ed., Handbook on Experimental Mechanics. Englewood Cliffs, NJ: Prentice-Hall, 1987, pp. 282-313.
6. C. Tsang, M. Stiteler, and C. Ume Real-time measurement of printed wiring board flatness in a simulated manufacturing environment," in Proc. INTERpack '95, Lahaina, HI, Mar. 26-30, 1995.
7. C. Yeh, C. Ume, R. Fulton, K. Wyatt, and J. Stafford Analytical and experimental approaches to determine thermally induced PWB warpage," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, pp. 986-995, Aug. 1993.
8. F P. Change Moiré methods of strain analysis," in SESA Manual on Experimental Stress Analysis, 3rd ed., Aug. 1979, pp. 290-308.
9. K. Creath Phase-measurement interferometry techniques," Progr. Optics, vol. 26, pp. 349-393, 1988.
10. J. Sullivan Phased stepped fraction Moiré," Exper. Mech., vol. 31, pp. 373-281, 1991.
11. G. Lai et al Generalized phase-shifting interferometry," J. Opt. Soc. Am. A, vol. 8, no. 5, pp. 822-827, 1991.
12. M. Sutler, C. Ume, and B. Leutz In-process board warpage measurement in a lab scale wave soldering oven," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 19, pp. 562-569, Dec. 1996.