Measurement of thermally induced warpage of BGA packages/substrates using phase-stepping shadow moire

Proceedings of the Electronic Technology Conference, EPTC

Volumn , Issue , 1997, Pages 283-289

  Wang, Yinyan ^a   Hassell, Patrick ^a  

^a Electronic Packaging Services Ltd Co   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

IMAGE ANALYSIS; MOIRE FRINGES; SUBSTRATES; SURFACE MEASUREMENT; THERMAL EFFECTS;

BALL GRID ARRAY PACKAGES; PHASE-STEPPING SHADOW MOIRE TECHNIQUE; THERMALLY INDUCED WARPAGE;

ELECTRONICS PACKAGING;

EID: 0031322857     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)