Measurement of residual stress in single crystal silicon wafers

2002 Proceedings - 8th International Advanced Packaging Materials Symposium

Volumn , Issue , 2002, Pages 297-301

  Vrinceanu, Isabela D ^a   Danyluk, Steven ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Residual stresses; Shadow moir interferometry; Single crystal silicon

Indexed keywords

DEFORMATION; INTERFEROMETRY; MONOCRYSTALLINE SILICON; PACKAGING MATERIALS; RESIDUAL STRESSES; SILICON; SINGLE CRYSTALS;

LARGE DEFLECTION; OUT-OF-PLANE DEFORMATIONS; OUT-OF-PLANE DISPLACEMENT; PERFORMANCE AND RELIABILITIES; SILICON SINGLE CRYSTALS; SINGLE CRYSTAL SILICON; SINGLE-CRYSTAL SILICON WAFERS; TANGENTIAL RESIDUAL STRESS;

SILICON WAFERS;

EID: 84949995822     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2002.990402     Document Type: Conference Paper

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