SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 291-297

Characterization of In-Process Substrate Warpage of Underfilled Flip Chip Assembly

(4) Zhang, Jian a Ding, Hai a Baldwin, Daniel F a Charles Ume, I a

a GEORGIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; FLIP CHIP DEVICES; RELIABILITY; RESIDUAL STRESSES; SENSORS; SOLDERING; ASSEMBLY; CHARACTERIZATION; CHIP SCALE PACKAGES; DELAMINATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); INDUSTRIAL ELECTRONICS; LEAD; MANUFACTURE; SILICON; SUBSTRATES; TESTING; VEHICLES;

FLIP CHIP ASSEMBLY;

ELECTRONICS PACKAGING; FLIP CHIP DEVICES;

EXPERIMENTAL APPROACHES; FLIP CHIP; FLIP CHIP ASSEMBLIES; FLIP CHIP ON BOARDS; PIEZORESISTANCE; PIEZORESISTIVE STRESS SENSORS; SHADOW MOIRE SYSTEM; UNDERFILL MATERIALS;

EID: 0141565355 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (8)

References (7)

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2
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- Assembly Test Chip Ver.04 (ATC04) Description and User's Guide
- J.N.Sweet, D.W.Peterson, M.R.Tuck, and J.M.Greene, "Assembly Test Chip Ver.04 (ATC04) Description and User's Guide", Sandia National Laboratories Report, SAND93-1901.
- Sandia National Laboratories Report , vol.SAND93-1901
- Sweet, J.N.¹ Peterson, D.W.² Tuck, M.R.³ Greene, J.M.⁴

3
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- Bittle, D.A.¹ Suhling, J.C.² Beaty, R.E.³ Jaeger, R.C.⁴ Johnson, R.W.⁵

4
- 0030714913
- Stresses From Flip Chip Assembly and Underfill: Mesaurements with the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method
- IEEE
- D.W.Peterson, J.N.Sweet, S.N.Burchett, A. Hsia, "Stresses From Flip Chip Assembly and Underfill: Mesaurements with the ATC4.1 Assembly Test Chip and Analysis by Finite Element Method", Proc. 47th Electronic components and Technology Conference, IEEE, 1997, pp 134-143.
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- Peterson, D.W.¹ Sweet, J.N.² Burchett, S.N.³ Hsia, A.⁴

5
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- John Wiley & Sons, Inc. (New York)
- Kafri, O., and Glatt, I., The Physics of Moiré Metrology, John Wiley & Sons, Inc. (New York, 1989).
- (1989) The Physics of Moiré Metrology
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6
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- Springer-Verlag, New York, chapters
- Post, D., Han, B., and Ifju, P., High Sensitivity Moiré, Springer-Verlag, New York, 1994, chapters, pp.118-130.
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7
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- Warpage Measurement Comparison Using Shadow Moiré and Projection Moiré Methods
- IEEE
- Ding, H., Powell, R.E., Hanna, C.R., and Urne, I.C., "Warpage Measurement Comparison Using Shadow Moiré and Projection Moiré Methods", Proc 52nd Electronic components and Technology Conference, IEEE, 2002, pp 176-182.
- (2002) Proc 52nd Electronic Components and Technology Conference , pp. 176-182
- Ding, H.¹ Powell, R.E.² Hanna, C.R.³ Urne, I.C.⁴

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.