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Volumn 9, Issue 4, 2006, Pages

A study of copper electroplating of the submicrometer scale patterns

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); ELECTRODEPOSITION; ELECTROLYTIC REDUCTION; ELECTROPLATING; PARTICLE ACCELERATORS; SCANNING ELECTRON MICROSCOPY;

EID: 33244483591     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2171813     Document Type: Article
Times cited : (8)

References (16)
  • 4
    • 0001978229 scopus 로고    scopus 로고
    • M. E.Gross, T.Gessner, N.Kobayashi, and Y.Yasuda, Editors, p. MRS, Warrendale, PA
    • J. Reid and S. Mayer, in Proceedings of Advanced Metallization Conference 1999, M. E. Gross, T. Gessner, N. Kobayashi, and, Y. Yasuda, Editors, p. 53, MRS, Warrendale, PA (2000).
    • (2000) Proceedings of Advanced Metallization Conference 1999 , pp. 53
    • Reid, J.1    Mayer, S.2
  • 8
    • 3743089917 scopus 로고
    • S. I. Krichmar, Sov. Electrochem., 1, 763 (1965), S. I. Krichmar, translated from Elektrokhimiya, 1, 858 (1965).
    • (1965) Sov. Electrochem. , vol.1 , pp. 763
    • Krichmar, S.I.1
  • 9
    • 0040921489 scopus 로고
    • S. I. Krichmar, Sov. Electrochem., 1, 763 (1965), S. I. Krichmar, translated from Elektrokhimiya, 1, 858 (1965).
    • (1965) Elektrokhimiya , vol.1 , pp. 858
    • Krichmar, S.I.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.