Effects of current waveform and bath temperature on surface morphology and texture of copper electrodeposits for ULSI

Materials Science Forum

Volumn 408-412, Issue II, 2002, Pages 1657-1662

  Lee, Hyo Jong ^a,b   Lee, Dong Nyung ^a  

^a Seoul National University   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Copper; Pulse Plating; Surface Morphology; Texture; ULSI

Indexed keywords

ASPECT RATIO; ELECTRODEPOSITION; EPITAXIAL GROWTH; MORPHOLOGY; SURFACES; TEXTURES; THERMAL EFFECTS; ULSI CIRCUITS; WAVEFORM ANALYSIS;

BATH TEMPERATURE;

COPPER COMPOUNDS;

EID: 0036999563     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.1657     Document Type: Conference Paper

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