Deformation behavior of electrolessly deposited ultrafine nanocrystalline copper films under instrumented nanoindentation

Electrochemical and Solid-State Letters

Volumn 9, Issue 4, 2006, Pages

  Chang, Shou Yi ^a,b   Chang, Ting Kui ^a   Lee, Yu Shuien ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b ELECTROCHEMICAL SOCIETY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER FILMS; DEFORMATION MECHANISM; NANOINDENTATION; VOIDING;

DEPOSITION; ELASTICITY; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; NANOSTRUCTURED MATERIALS; THIN FILMS;

COPPER;

EID: 33244473036     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2173190     Document Type: Article

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