Prediction of thermo-mechanical integrity of wafer backend processes

Microelectronics Reliability

Volumn 44, Issue 12, 2004, Pages 2011-2017

  Gonda, V ^a   Den Toonder, J M J ^b   Beijer, J ^b   Zhang, G Q ^b   Van Driel, W D ^b   Hoofman, R J O M ^b   Ernst, L J ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DEGREES OF FREEDOM (MECHANICS); MACHINE DESIGN; MECHANICAL PROPERTIES; STRESS ANALYSIS; TEMPERATURE DISTRIBUTION; THERMAL LOAD; THERMOANALYSIS;

DESIGN PHASE; INTERNATIONAL TECHNOLOGY ON ROADMAP FOR SEMICONDUCTORS (ITRS); THERMOMECHANICAL LOADING; WAFER BACKEND PROCESS;

SILICON WAFERS;

EID: 6344223433     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.05.021     Document Type: Conference Paper

References (10)

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