SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 83, Issue 2, 2006, Pages 236-240

Study of ultrathin vanadium nitride as diffusion barrier for copper interconnect

(6) Qu, Xin Ping a Zhou, Mi a Chen, Tao a Xie, Qi a Ru, Guo Ping a Li, Bing Zong a

a FUDAN UNIVERSITY (China)

Author keywords

Copper interconnect; Diffusion barrier; Vanadium nitride

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; DIFFUSION IN SOLIDS; INTERCONNECTION NETWORKS; NITRIDES; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; SPUTTERING; THERMODYNAMIC STABILITY; ULTRATHIN FILMS; X RAY DIFFRACTION ANALYSIS;

COPPER INTERCONNECTS; DIFFUSION BARRIER PROPERTIES; DIFFUSION BARRIERS; VANADIUM NITRIDE;

VANADIUM COMPOUNDS;

EID: 32044433048 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/j.mee.2005.08.009 Document Type: Article

Times cited : (17)

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