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Volumn 23, Issue 2, 2005, Pages 463-467

Copper diffusion barrier properties of CVD boron carbo-nitride

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC BREAKDOWN; DIFFUSION BARRIER PROPERTIES;

EID: 31144447596     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1865072     Document Type: Conference Paper
Times cited : (11)

References (22)
  • 5
    • 84944032317 scopus 로고    scopus 로고
    • 2003 IEEE International Interconnect Technology Conference
    • K. Goto, H. Yuasa, A. Andatsu, and M. Matsuura, 2003 IEEE International Interconnect Technology Conference (2003), p. 6.
    • (2003) , pp. 6
    • Goto, K.1    Yuasa, H.2    Andatsu, A.3    Matsuura, M.4
  • 10
    • 0842286058 scopus 로고    scopus 로고
    • 2003 IEEE International Interconnect Technology Conference
    • T. Y. Tsui, R. Willecke, and A. J. McKerrow, 2003 IEEE International Interconnect Technology Conference (2003), p. 45.
    • (2003) , pp. 45
    • Tsui, T.Y.1    Willecke, R.2    McKerrow, A.J.3
  • 14
    • 31144466447 scopus 로고    scopus 로고
    • New Jersey Institute of Technology
    • N. Ramanuja, dissertation, New Jersey Institute of Technology, 2000.
    • (2000)
    • Ramanuja, N.1
  • 18
    • 0003612633 scopus 로고    scopus 로고
    • edited by J. C.Riviere and S.Myhra (Marcel Dekker, New York
    • Handbook of Surface and Interface Analysis, edited by, J. C. Riviere, and, S. Myhra, (Marcel Dekker, New York, 1998).
    • (1998) Handbook of Surface and Interface Analysis


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.