|
|
|
Volumn 25, Issue 13, 2002, Pages 63-68
|
|
Mixing signals with 3-D integration
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
3-D INTEGRATION TECHNOLOGY;
CELL PHONES;
DIE-TO-WAFER BONDING;
SYSTEM-ON-A-CHIP (SOC);
ZIPTRONIX BONDING TECHNOLOGY;
ANALOG TO DIGITAL CONVERSION;
BONDING;
CHEMICAL MECHANICAL POLISHING;
CMOS INTEGRATED CIRCUITS;
DIGITAL DEVICES;
HERMETIC DEVICES;
IMAGE PROCESSING;
IMAGING TECHNIQUES;
INTEGRATED OPTICS;
MICROELECTROMECHANICAL DEVICES;
OPTICAL INTERCONNECTS;
PROM;
RELIABILITY;
SCANNING ELECTRON MICROSCOPY;
SILICON WAFERS;
THERMAL EFFECTS;
SEMICONDUCTOR DEVICE MANUFACTURE;
|
|
EID: 3042803978
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Review |
|
Times cited : (8)
|
|
References (0)
|
