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Volumn 41, Issue 3, 2004, Pages 35-39
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Chips go vertical
a
a
NONE
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Author keywords
[No Author keywords available]
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Indexed keywords
ALUMINUM;
COPPER;
DYNAMIC RANDOM ACCESS STORAGE;
ELECTRONICS PACKAGING;
GATES (TRANSISTOR);
INTEGRATED CIRCUIT LAYOUT;
MICROELECTRONICS;
MICROPROCESSOR CHIPS;
PERFORMANCE;
SILICON WAFERS;
THREE DIMENSIONAL;
TRANSISTORS;
CHIP DESIGN;
MICROCHIP;
SEMICONDUCTOR INDUSTRY;
THREE DIMENSIONAL INTEGRATED CIRCUIT;
INTEGRATED CIRCUIT MANUFACTURE;
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EID: 1542607353
PISSN: 00189235
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (22)
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References (0)
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