Estimation of thermal fatigue resistances of Sn-Ag and Sn-Ag-Cu lead-free solders using strain rate sensitivity index

Materials Transactions

Volumn 46, Issue 11, 2005, Pages 2329-2334

  Shohji, Ikuo ^a   Yasuda, Kiyokazu ^b   Takemoto, Tadashi ^b  

^a GUNMA UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Lead free solder; Mechanical properties; Strain rate sensitivities; Tensile test; Thermal fatigue; Tin silver; Tin silver copper

Indexed keywords

AGING OF MATERIALS; FATIGUE OF MATERIALS; LEAD; MECHANICAL PROPERTIES; SENSITIVITY ANALYSIS; STRAIN RATE; TENSILE TESTING; TIN ALLOYS;

LEAD-FREE SOLDER; STRAIN RATE SENSITIVITIES; THERMAL FATIGUE; TIN-SILVER; TIN-SILVER COPPER;

SOLDERING;

EID: 30844461687     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2329     Document Type: Article

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