Mechanical properties and estimation of thermal fatigue properties of lead-free solders

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1623-1628

  Takemoto, Tadashi ^a   Takahashi, Masahiro ^a,b   Ninomiya, Ryuji ^c   Matsunawa, Akira ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Tanaka Kikinzoku Kogyo KK   (Japan)

^c MITSUI MINING AND SMELTING CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039380458     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (10)

1. Allenby, B. R., et al., 1993, Circuit World, Vol. 19, No. 2, pp. 18.
2. Harris, P. G. and Whitmore, M. A., 1993, Circuit World, Vol. 19, No. 2, pp. 25.
3. Jin, S. et al., 1993, "Developing Lead-Free Solders: A Challenge and Opportunity", JOM, No. 6, pp. 13-40.
4. Kattner, U. R., and Boettinger, W. J., "On the Sn-Bi-Ag Ternary Phase Diagram", 1994, J. Electronic Mat., Vol. 23, No. 7, pp. 603.
5. Klein Wassink, R. J., 1989, "Soldering in Electronics", 2nd Ed., Electrochemical Pub., Scotland.
6. Lau, J. H., 1994, "Solder Joint Reliability", Van Nostrand Reinhold, New York.
7. Vincent, J. H., et al., 1993, Circuit World, Vol. 19, No. 3, pp. 32.
8. Takemoto, T. et al., J. Mat. Sci., "Tensile test for estimation of thermal fatigue properties of solder alloys", Vol., to be published.
9. Massalski, T. B., 1990, "Binary Alloy Phase Diagrams, 2nd. Ed., Vol. 1-3.
10. Lee, J. A., and Raynor, G. V., 1954, Proc. Phys. Soc., Vol. B67, 737.