Tensile deformation properties and microstructure of Sn-Zn system lead-free solders

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 575-580

  Takemoto, Tadashi ^a   Takahashi, Masahiro ^b   Matsunawa, Akira ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Tanaka Kikinzoku Kogyo KK   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346402737     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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2. Allenby, B. R. et al., 1993, "An Assessment of the Use of Lead in Electronics Assembly, Part 2", Circuit World, Vol. 19, No. 3, pp. 25-31.
3. Artaki, I. et al., 1994, "Evaluation of Lead-Free Solder Joints in Electronic Assemblies", J. Electronic Materials, Vol. 23, No. 8, pp. 757-764.
4. Artaki, I. et al., 1995, "Fine Pitch Surface Mount Technology Assembly with Lead-free, Low Residue Solder Paste", Soldering & Surface Mount Technology, No. 20, pp. 27-32.
5. Harris, P. G. and Whitmore, M. A., 1993, "Alternative Solders for Electronics Assemblies, Part 1: Materials Selection, Circuit World, Vol. 19, No. 2, pp. 25-27.
6. Hwang, J. S. and Guo, Z, 1994, "Lead-free Solders for Electronic Packaging and Assembly", Circuit World, Vol. 20, pp. 19-25.
7. Loomans, M. E. et al., 1994, "Investigation of Multi-Component Lead-Free Solders", J. Electronic Materials, Vol. 23, No. 8, pp. 741-746.
8. Takemoto, T., 1996, "Lead-free Solder and Micro-joining", Materia Japan, Vol. 35, No. 4, pp. 320-325.
9. Takemoto, T. et al., 1997a, "Mechanical Properties and Estimation of Thermal Fatigue Properties of Lead-free Solders", Advances in Electronic Packaging, Vol. EEP 19-2, pp. 1623-1628.
10. Takemoto, T. et al., 1997b, "Tensile Test for Estimation of Thermal Fatigue Properties of Solder Alloys", J. Mat. Sci., Vol. 32, No. 5, pp. 4077-4084.
11. Takemoto, T. et al., 1998, "Effect of Addition of Bismuth or Indium on Microstructure and Mechanical properties of Environmentally Compatible Lead-free Solders", Proc. 4th Symposium on Microjoining and Assembly Technology in Electronics (Mate '98), pp. 243-248.
12. Villars, et al., 1995, "Handbook of Ternary Alloy Phase Diagrams", ASM International, Ohio.
13. Vincent, J. H. et al., 1993, "Alternative Solders for Electronics Assemblies, Part 2: UK Progress and Preliminary Trials", Circuit World, Vol. 19, No. 3, pp. 32-34.