Realization of nanoscale resolution with a micromachined thermally actuated testing stage

Review of Scientific Instruments

Volumn 75, Issue 6, 2004, Pages 2154-2162

  Lu, Shaoning ^a   Dikin, Dmitriy A ^a   Zhang, Sulin ^a   Fisher, Frank T ^a   Lee, Junghoon ^a   Ruoff, Rodney S ^a  

^a Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP REACTIVE ION ETCHING (DRIE); MICROFABRICATIONS; NANOSCALE RESOLUTION;

AMPLIFICATION; DEFORMATION; ETCHING; MATHEMATICAL MODELS; MICROPROCESSOR CHIPS; NANOSTRUCTURED MATERIALS; SEMICONDUCTING SILICON; STRESS ANALYSIS;

MICROELECTROMECHANICAL DEVICES;

EID: 3042735467     PISSN: 00346748     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1710703     Document Type: Article

References (25)

1. M. F. Yu, B. S. Files, S. Arepalli, and R. S. Ruoff, Phys. Rev. Lett. 84, 5552 (2000).
2. M. F. Yu, M. J. Dyer, G. D. Skidmore, H. W. Rohrs, X. K. Lu, K. D. Ausman, J. R. Von Ehr, and R. S. Ruoff, Nanotechnology 10, 244 (1999).
3. M. F. Yu, O. Lourie, M. J. Dyer, K. Moloni, T. F. Kelly, and R. S. Ruoff, Science 287, 637 (2000).
4. M. F. Yu, B. I. Yakobson, and R. S. Ruoff, J. Phys. Chem. B 104, 8764 (2000).
5. Z. W. Pan, S. S. Xie, L. Lu, B. H. Chang, L. F. Sun, W. Y. Zhou, G. Wang, and D. L. Zhang, Appl. Phys. Lett. 74, 3152 (1999).
6. J. J. Yao, S. C. Arney, and N. C. MacDonald, J. Microelectromech. Syst. 1, 14 (1992).
7. J. Brugger, V. P. Jaecklin, C. Linder, N. Blanc, P. F. Indermuhle, and N. F. de Rooij, J. Micromech. Microeng. 3, 161 (1993).
8. N. D. Mankame and G. K. Ananthasuresh, J. Micromech. Microeng. 11, 452 (2001).
9. P. A. Williams, S. J. Papadakis, M. R. Falvo, A. M. Patel, M. Sinclair, A. Seeger, A. Heiser, R. M. Taylor, S. Washburn, and R. Superfine, Appl. Phys. Lett. 80, 2574 (2002).
10. G. G. Demczyk, Y. M. Wang, J. Cumings, M. Hetman, W. Han, A. Zettl, and R. O. Ritchie, Mater. Sci. Eng., A 334, 173 (2002).
11. E. H. Klaassen, K. E. Petersen, J. M. Noworolski, J. R. Logan, N. I. Maluf, J. Brown, C. Storment, W. McCulley, and G. T. A. Kovacs, Proceedings of the Eighth International Conference on Solid-State Sensors and Actuators and Eurosensors IX: Digest of Technical Papers (IEEE, Stockholm, 1995), pp. 556-559.
12. M.-F. Wu, C.-H. C. Lin, and W. Hsu, J. Intell. Mater. Syst. Struct. 10, 402 (1999).
13. L. L. Chu and Y. B. Gianchandani, J. Micromech. Microeng. 13, 279 (2003).
14. E. S. Kolesar, P. B. Allen, J. T. Howard, and J. M. Wilken, J. Vac. Sci. Technol. A 17, 2257 (1999).
15. R. R. A. Syms, J. Micromech. Microeng. 12, 211 (2002).
16. D. M. Burns and V. M. Bright, SPIE Int. Soc. Opt. Eng. 3224, 296 (1997).
17. J. H. Comotois and V. M. Bright, Sens. Actuators, A 58, 19 (1997).
18. T. Moulton and G. K. Ananthasuresh, Sens. Actuators, A 90, 38 (2001).
19. N. Takeshima, K. J. Gabriel, M. Ozaki, J. Takahashi, H. Horiguchi, and H. Fujita, Transducers' 91: International Conference on Solid-State Sensors and Actuators (IEEE, San Francisco, 1991), pp. 63-66.
20. Y. B. Gianchandani and K. Najafi, J. Microelectromech. Syst. 5, 52 (1996).
21. L. Que, J.-S. Park, and Y. B. Gianchandani, J. Microelectromech. Syst. 10, 247 (2001).
22. Y. Okada and Y. Tokumaru, J. Appl. Phys. 56, 314 (1984).
23. M. J. Madou, Fundamentals of Microfabricaton (CRC Press, Boca Raton, 1997).
24. L. Y. Lin, J. L. Shen, S. S. Lee, and M. C. Wu, IEEE Photonics Technol. Lett. 9, 345 (1997).
25. R. J. Linderman and V. M. Bright, Sens. Actuators, A 91, 292 (2001).