Conversion of uniform colloidal Cu2O spheres to copper in polyols

Journal of Materials Research

Volumn 18, Issue 4, 2003, Pages 1017-1022

  Crnjak Orel, Zorica ^a,b   Matijević, Egon ^a   Goia, Dan V ^a  

^a CLARKSON UNIVERSITY   (United States)

^b NATIONAL INSTITUTE OF CHEMISTRY   (Slovenia)

Author keywords

[No Author keywords available]

Indexed keywords

COLLOIDS; CRYSTALLINE MATERIALS; GLYCOLS; NANOSTRUCTURED MATERIALS; SINTERING; THERMAL EFFECTS;

INTERMEDIATE COMPOUNDS;

COPPER OXIDES;

EID: 0037662086     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2003.0139     Document Type: Article

References (28)

1. J.K.A. Clarke, Chem. Rev. 75, 291 (1975).
2. 2. G.M. Mills and J.A. Cusumano, in Encyclopedia of Chemical Technology (Wiley Interscience, New York, 1979), pp. 16-61.
3. H.B. Weiser, Inorganic Colloid Chemistry (Wiley, New York, 1933), Vol. 1, pp. 131-142.
4. Modern Developments in Powder Metallurgy, edited by H.H. Hausner (Plenum Press, New York, 1966), Vol. 1.
5. J.R. Larry, R.M. Rosenberg, and R.G. Uhler, IEEE Transactions on Components Hybrids and Manufacturing Technology (IEEE, Piscataway, NJ, 1980), pp. 168-174.
6. D.W. Hamer and J.V. Biggers, Thick Film Hybrid Microcircuit Technology (Wiley Interscience, New York, 1972).
7. L.I. Masussek and R. Glang, Handbook of Thin Film Technology (McGraw-Hill, New York, 1970).
8. J.L. Vosson and W. Kern, Thin Film Processes (Academic Press, New York, 1970).
9. G.N. Glavee, J. Klabunde, C.M. Sorensen, and G.C. Hadjipanayis, Langmuir 10, 4276 (1994).
10. L. Qi, J. Ma, and J. Shen, J. Colloid Interface Sci. 186, 498 (1997).
11. W.P. Hsu, R. Yu, and E. Matijević, Powder Technol. 63, 265 (1990).
12. C.H. Huang and R.S. Sheen, Mater. Lett. 30, 357 (1997).
13. A. Filankembo and M.P. Pileni, Appl. Surface Sci. 164, 260 (2000).
14. F. Fiévet, in Fine Particles, Synthesis, Characterization and Mechanisms of Growth, edited by T. Sugimoto (Marcel Dekker, New York, 2000), pp. 460-496.
15. F. Fiévet, J.P. Largier, and M. Figlarz, MRS Bull. 14, 29 (1989).
16. F. Fiévet, J.P. Largier, B. Blin, B. Beaudoin, and M. Figlarz, Solid State Ionics 32/33, 198 (1989).
17. C. Ducamp-Seanguesa, R. Herrera-Urbina, and M. Figlarz, J. Solid State Chem. 100, 272 (1992).
18. M. Figlarz, F. Fiévet, and J.P. Largier, U.S. Patent No. 4 539 041 (1985).
19. F. Fiévet, F. Fievet-Vincent, J.P. Lagier, B. Dumont, and M. Figlarz, J. Mater. Chem. 3, 627 (1993).
20. T. Shono, Y. Matsumura, T. Hashimoto, K. Hibino, H. Hamaguchi, and T. Aoki, J. Am. Chem. Soc. 97, 2546 (1975).
21. S. Ernst, J. Heitbaum, and C.H. Hamaan, J. Electroanal. Chem. 173, 100 (1979).
22. M.L. Rao, J. Electroanal. Chem. 334, 116 (1969).
23. W.P. Hsu, L. Rönnquist, and E. Matijević, Langmuir 4, 26 (1988).
24. M. Ocaña and E. Matijević, J. Mater. Res. 5, 1083 (1990).
25. D.V. Goia and E. Matijević, Colloids Surf. 146, 139 (1999).
26. V. Privman, D.V. Goia, J. Park, and E. Matijević, J. Colloid Interface Sci. 213, 36 (1999).
27. S. Libert, V. Gorshkov, V. Privman, D.V. Goia, and E. Matijević, Adv. Colloid Interface Sci. 102-102c, 169 (2003).
28. A. Henglein, J. Phys. Chem. B 104, 1206 (2000).