Development of thermodynamic database for micro-soldering alloys

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 91-96

  Ohnuma, I ^a   Liu, X J ^a   Ohtani, H ^a   Anzai, K ^a   Kainuma, R ^a   Ishida, K ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Bismuth; Copper alloys; Databases; Isothermal processes; Optimization methods; Solid modeling; Thermodynamics; Tin alloys; X ray diffraction; Zinc

Indexed keywords

BISMUTH; BISMUTH ALLOYS; COPPER ALLOYS; DATABASE SYSTEMS; ELECTRONICS PACKAGING; GRAPHIC METHODS; ISOTHERMS; LEAD; LEAD-FREE SOLDERS; PHASE DIAGRAMS; PHASE EQUILIBRIA; SOLDERING; TERNARY SYSTEMS; THERMODYNAMIC PROPERTIES; THERMODYNAMICS; TIN; TIN ALLOYS; X RAY DIFFRACTION; ZINC;

CALCULATED PHASE DIAGRAMS; CALCULATION OF PHASE DIAGRAMS; EXPERIMENTAL DETERMINATION; ISOTHERMAL PROCESS; NON-EQUILIBRIUM SOLIDIFICATION; OPTIMIZATION METHOD; SOLID MODEL; X-RAY DIFFRACTION TECHNIQUES;

SOLDERING ALLOYS;

EID: 84949551569     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906355     Document Type: Conference Paper

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