Pasty ranges and latent heat release modes for Sn-9Zn-xAg lead-free solder alloys

Materials Transactions

Volumn 45, Issue 6, 2004, Pages 1949-1957

  Tsai, Ying Ling ^a   Hwang, Weng Sing ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Computer aided cooling curve analysis; Latent heat release mode; Lead free solder; Pasty range; Tin zinc silver alloy

Indexed keywords

ELECTRIC INSULATORS; FREEZING; HEAT TRANSFER; MATHEMATICAL MODELS; SOLDERING ALLOYS; THERMAL EFFECTS; THERMOCOUPLES; WETTING; ZINC;

LATENT HEAT RELEASE MODES; LEAD-FREE SOLDERS; PASTY RANGE; SOLDER ALLOYS;

TIN ALLOYS;

EID: 4043156329     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.45.1949     Document Type: Article

References (24)

1. M. McCormack, S. Jin and G. W. Kammlott: Proceedings of the 1995 IEEE International Symposium on Electronics and Environment, (ISEE, Orlando, FL, USA, May 1995) pp. 171-176.
2. NCMS, Lead-free Solder Project Final Report, NCMS Report 0401 RE 96, (National Center for Manufacturing Sciences, Michigan, 1997).
3. K. Suganuma: Curr. Opin. Solid State Mater. Sci. 5 (2001) 55-64.
4. H. W. Miao and J. G. Duh: Mater. Chem. Phys. 71 (2001) 255-271.
5. M. Rettenmayr, P. Lambracht, B. Kempf and C. Tschudin: J. Electron. Mater. 31 (2002) 278-285.
6. J. Glazer: Inter. Mater. Rev. 40 (1995) 65-93.
7. A. Mulugeta and S. Gunna: Mater. Sci. Eng. 27 (2000) 95-141.
8. F. Hua and J. Glazer: Design and Reliability of Solders and Solder Interconnections, (TMS Annual Meeting, 1997) pp. 65.
9. S. Vaynman and M. E. Fine: Scr. Mater. 41 (1997) 1269-1271.
10. T. Takemoto, T. Funaki and A. Matsunawa: J. of Jap. Weld. Soc. 17 (1999) 251-258.
11. D. M. Stefanescu, G. Upadhya and D. Bandyopadhyay: Metal. Trans. A 21A (1990) 997-1005.
12. I. G. Chen and D. M. Stefanescu: AFS Trans 92 (1984) 947-965.
13. K. G. Upadhya, D. M. Stefanescu, K. Lieu and D. P. Yeager: AFS Trans. 97 (1989) 61-66.
14. C. H. Su and H. L. Tsai: AFS Trans. 99 (1991) 781-789.
15. J. H. Chen and H. L. Tsai: AFS Trans. 98 (1990) 539-546.
16. S. H. Jong and W. S. Hwang: AFS Trans. 100 (1992) 939-946.
17. Y. F. Chen, S. H. Jong and W. S. Hwang: Mater. Sci. Tech. 12 (1996) 539-544.
18. J. O. Barlow and D. M. Stefanescu: AFS Trans. 105 (1997) 349-354.
19. S. Argyropoulos, B. Closset, J. E. Gruzleski and H. Oger: AFS Trans. 91 (1983) 351-358.
20. J. H. Lienhard IV and J. H. Lienhard V: A Heat Transfer Textbook, 3rd Edition, (Phlogiston Press, Cambridge, 2002) pp. 21-25.
21. H. Huang, V. K. Suri, J. L. Hill and J. T. Berry: AFS Trans. 99 (1991) 685-689.
22. J. R. Lloyd, C. Zhang and H. L. Tan: IEEE/CPMT International Electronics Manufacturing Technology Symposium, (Institute of Electrical and Electronics Engineers, Austin, 1995) pp. 252-262.
23. J. H. Lau and C. Chang: Electronic Components and Technology Conference, (Institute of Electrical and Electronics Engineers, Seattle, 1998) pp. 1339-1344.
24. J. M. Song, G. F. Lan, T. S. Lui and L. H. Chen: Scri. Mater. 48 (2003) 1047-1051.