Measurements of thermal expansion coefficients and melting ranges for Sn-9Zn-xAg lead-free solder alloys

International Journal of Cast Metals Research

Volumn 15, Issue 3, 2002, Pages 181-186

  Tsai, Ying Ling ^a   Hwang, Weng Sing ^a   Wang, Huei Sen ^b   Wu, Mei Hui ^c  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b DIWAN COLLEGE OF MANAGEMENT   (Taiwan)

^c CHINA STEEL CORPORATION   (Taiwan)

Author keywords

Coefficient of thermal expansion; Lead free solder; Melting range

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DILATOMETERS; HEATING; MELTING; MICROSTRUCTURE; SILVER; SOLDERING; THERMAL EXPANSION; THERMAL STRESS; THERMODYNAMIC PROPERTIES;

SOLDER ALLOYS;

TIN ALLOYS;

EID: 0037003659     PISSN: 13640461     EISSN: None     Source Type: Journal    
DOI: 10.1080/13640461.2003.11819480     Document Type: Conference Paper

References (6)

1. K. N. Tu and K. Zeng, ì Tin-Lead (SnPb) Solder Reaction in Flip Chip Technologyî, Materials Science and Engineering, R34(2001), pp1-58.
2. A. Mulugeta and S. Gunna, ì Lead-free Solders in Microelectronicsî, Materials Science and Engineering 27(2000), pp95-141.
3. J. Glazer, ì Metallurgy of Low Temperature Pb-free Solders for Electronic Assemblyî, International Material Reviews, 40(2)(1995), pp65-93.
4. T. Takemoto, T. Funaki, and A. Matsunawa, ì Electrochemical Investigation on the Effect of Silver Addition on Wettability of Sn-Zn System Lead-Free Solderî, Journal of Japan Welding Society, Vol. 17, No 2, 1999, pp251-258.
5. E. P. Wood and K L. Nimmo, ì In Search of New Lead-free Electronic Soldersî, Journal of Electronic Materials, 23(8)(1994),pp709-713.
6. S. W. Chen, C. C. Lin and C. M. Chen, ì Determination of the Melting and Solidification Characteristics of Solders Using Differential Scanning Calorimetryî, Metallurgical and Materials TransactionsA, 29A(1998), pp1965-1972.