Dynamic thermal characterization and modeling of packaged AlGaAs/GaAs HBT's

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 2, 2000, Pages 352-359

  Busani, Matteo ^a   Menozzi, Roberto ^b   Borgarino, Mattia ^c   Fantini, Fausto ^c  

^a UNIVERSITY OF PARMA   (Italy)

^b LAAS CNRS   (France)

^c UNIVERSITY OF MODENA AND REGGIO EMILIA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MICROWAVE DEVICES; PULSE GENERATORS; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MODELS; THERMODYNAMIC PROPERTIES; TRANSIENTS;

COMPONENT THERMAL CHARACTERIZATION; JUNCTION TEMPERATURE PREDICTION; THERMAL PERFORMANCE; TRANSIENT ANALYSIS;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 0033723927     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.846774     Document Type: Article

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