Finite element transient thermal analysis of electronic boards and packages using moment-matching techniques

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 391-395

  Phanilatha, V ^a   Nakhla, Michel S ^a   Zhang, Qi Jun ^a   Liu, Da Guang ^a  

^a CARLETON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; DIFFERENTIAL EQUATIONS; FINITE ELEMENT METHOD; HEAT TRANSFER; ITERATIVE METHODS; MATHEMATICAL MODELS;

MOMENT MATCHING TECHNIQUES; THERMAL DESIGN;

ELECTRONICS PACKAGING;

EID: 0029696055     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (21)