Low-loss RF MEMS metal-to-metal contact switch with CSP structure

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 1, Issue , 2003, Pages 340-341

  Seki, T ^a   Sato, S ^a   Masuda, T ^a   Kimura, I ^a   Imanaka, K ^a  

^a OMRON CORPORATION   (Japan)

Author keywords

Chip scale packaging; Contacts; Glass; Insertion loss; Isolation technology; Printed circuits; Radiofrequency microelectromechanical systems; Switches; Wafer bonding; Wafer scale integration

Indexed keywords

ACTUATORS; CHIP SCALE PACKAGES; CONTACTS (FLUID MECHANICS); ELECTROMECHANICAL DEVICES; GLASS; GLASS BONDING; INSERTION LOSSES; MEMS; MICROSYSTEMS; PRINTED CIRCUITS; SILICON WAFERS; SINGLE CRYSTALS; SOLID-STATE SENSORS; SUBSTRATES; SWITCHES; TRANSDUCERS; WAFER BONDING; WSI CIRCUITS;

CHIP-SCALE PACKAGING; ISOLATION TECHNOLOGY; LOW INSERTION LOSS; METAL-TO-METAL CONTACT; RADIO FREQUENCIES; SINGLE CRYSTAL SILICON; WAFER LEVEL PACKAGING; WAFER-LEVEL PACKAGING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 52249112384     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1215322     Document Type: Conference Paper

References (4)

1. J Jason Yao, "RF MEMS from a device perspective", J.Micromech. Microeng. 10 (2000) R9-R38, April. 2000
2. G. M. Rebeiz and J.B. Muldavin, "RF MEMS switches, switch circuits, and phase shifters", SUMBITTED HFREVIEW, Jun. 2001
3. Y. K. Park, et al., "A novel low-loss wafer-level packaging of the RF-MEMS devices", MEMS 2002, pp. 681-684, Jan. 2002
4. A. Jourdain, P. De Moor, S. Pamidighantam and H. A. C. Tilmans, "Investigation of the hermeticity of BCB-sealed cavities for housing (RF-) MEMS devices", MEMS 2002, pp. 677-680, Jan. 2002