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Volumn 43, Issue 2, 2002, Pages 227-231
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The influence of phosphorus concentration of electroless plated Ni-P film on interfacial structures in the joints between Sn-Ag solder and Ni-P alloy film
a
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Author keywords
Interface structure; Lead free solder; Phosphorus concentration; Plated electroless nickel film
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Indexed keywords
CRYSTALLIZATION;
ELECTROLESS PLATING;
INTERFACES (MATERIALS);
NICKEL ALLOYS;
PHOSPHORUS;
SEMICONDUCTING INTERMETALLICS;
SOLDERED JOINTS;
SOLDERING ALLOYS;
PLATED ELECTROLESS NICKEL FILMS;
METALLIC FILMS;
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EID: 0036475370
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.43.227 Document Type: Article |
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Times cited : (11)
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References (13)
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