Modelling and analysis of pad surface topography and slurry particle size distribution effects on material removal rate in chemical mechanical planarisation

International Journal of Manufacturing Technology and Management

Volumn 7, Issue 5-6, 2005, Pages 504-529

  Wang, Changxue ^a   Sherman, Peter ^a,c,d,e   Chandra, Abhijit ^b  

^a IOWA STATE UNIVERSITY   (United States)

^b Iowa State University   (United States)

^c ASME   (United States)

^d IEEE   (United States)

^e Chemistry Section   (United States)

Author keywords

Chemical mechanical planarisation (CMP); Contact mechanics; Material removal rate (MRR); Pad surface roughness; PDF; Slurry particle size distribution; Static and dynamic models; Stochastic process; Topography evolution

Indexed keywords

COMPUTER SIMULATION; DYNAMIC MECHANICAL ANALYSIS; MECHANICAL PROPERTIES; TOPOLOGY;

CMP PROCESS; MATERIAL REMOVAL RATE; MECHANICAL PLANARIZATION; SLURRY PARTICLES;

SURFACE TOPOGRAPHY;

EID: 28844500407     PISSN: 13682148     EISSN: None     Source Type: Journal    
DOI: 10.1504/IJMTM.2005.007700     Document Type: Article

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