Fracture property improvements of a nanoporous thin film via post deposition bond modifications

Materials Research Society Symposium Proceedings

Volumn 863, Issue , 2005, Pages 61-66

  Jacques, Jeannette M ^a   Tsui, Ting Y ^a   McKerrow, Andrew J ^a   Kraft, Robert ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DIELECTRIC FILMS; ELECTRON BEAMS; FRACTURE; SILICON; STRENGTH OF MATERIALS; THIN FILMS;

CHANNEL CRACKING; MECHANICAL FILM PROPERTIES; NANOPOROUS THIN FILMS; ORGANOSILICATE GLASS (OSG);

NANOSTRUCTURED MATERIALS;

EID: 28844499948     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-863-b3.8     Document Type: Conference Paper

References (15)

1. R.F. Cook and E.G. Liniger, J. Electrochem. Soc. 146 (12), 4439 (1999).
2. R.F. Cook and Z. Zuo, Materials Research Society (MRS) Bulletin, January 2002, 45.
3. H. Miyajima, K. Fujita, R. Nakata, T. Yoda, and N. Hayasaka. IEEE Pro. International Interconnect Technology Conference 2004 (Pg. 222-224), San Francisco, CA.
4. H. Nagai, K. Maekawa, M. Iwashita, M. Muramatsu, et al. IEEE Proc. International Interconnect Technology Conference 2004 (Pg. 145-147), San Francisco, CA.
5. E. Mickler, C.-T. Lin, A. T. Krishnan, C. Jin, and M. Jain. IEEE Proc. International Interconnect Technology Conference 2004 (Pg. 190-192), San Francisco, CA.
6. R.F. Cook, Mat. Sci. and Eng., A, 260, 29 (1999).
7. T.Y. Tsui, A.J. Griffin, Jr., J. Jacques, R. Fields, A.J. McKerrow, and R. Kraft, "Effects of Elastic Modulus on the Fracture Behavior of Low-Dielectric Constant Films", IEEE Proc. International Interconnect Technology Conference 2005, San Francisco, CA.
8. nd ed. Springer-Verlag: New York (1993).
9. R.H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, Eng. Fract. Mech. 61, 141 (1998).
10. M. Lane, N. Krishna, I. Hashim, and R.H. Dauskardt, J. Mat. Res. 15 (1), 203 (2000).
11. M.W. Lane, J.M. Snodgrass, and R.H. Dauskardt, Microelectronics Reli. 41, 1615 (2001).
12. K. Fujita, H. Miyajima, R. Nakata, and N. Miyashita. IEEE Proc. International Interconnect Technology Conference 2003 (Pg. 106-108), San Francisco, CA.
13. C. Litteken, R. Dauskardt, T. Scherban, G. Xu, J. Leu, D. Gracias, and B. Sun. IEEE Proc. International Interconnect Technology Conference 2003 (Pg. 168-170), San Francisco, CA.
14. A. Grill and D.A. Neumayer, J. Appl. Phys. 94 (10), 6697 (2003).
15. st ed., edited by David R. Lide. CRC Press, Inc.: Boston (1990).