The application of simultaneous eBeam cure method for 65 nm node Cu/Low-k technology with hybrid (PAE/MSX) structure

Proceedings of the IEEE 2004 International Interconnect Technology Conference

Volumn , Issue , 2004, Pages 222-224

  Miyajima, H ^a   Fujita, K ^a   Nakata, R ^a   Yoda, T ^a   Hayasaka, N ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CURING; ELECTRON BEAMS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTERCONNECTION NETWORKS; OPTIMIZATION; PERMITTIVITY; PORE SIZE; RAMAN SPECTROSCOPY; REACTIVE ION ETCHING; RELIABILITY; SHRINKAGE; STRENGTH OF MATERIALS;

ADHESION STRENGTH; ELECTRON DOSAGE; POLY-ARYLENE-ETHER (PAE); THERMAL CURING;

ETHERS;

EID: 8644275608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. M. Shimada et al., SSDM, p. 416, 2001
2. K. Fujita et al., IITC, p. 106, 2003
3. A. Kajita et al., IITC, p. 9, 2003
4. R. kanamura et al., 2003 Symp. of VLSI Tech., P.107