Effects of elastic modulus on the fracture behavior of low-dielectric constant films

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 63-65

  Tsui, Ting Y ^a   Griffin Jr , A J ^a   Jacques, Jeannette ^a   Fields, Russell ^a   McKerrow, Andrew J ^a   Kraft, Robert ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK PROPAGATION; DIELECTRIC MATERIALS; FRACTURE TESTING; OPTIMIZATION; THIN FILMS;

CHANNEL-CRACK PROPAGATION; FRACTURE PARAMETERS; MATERIAL CONSTANTS;

ELASTIC MODULI;

EID: 28244435127     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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5. R.F. Cook and E.G. Liniger, "Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films", J. Elect Soc. 146, p. 4439-48, 1999.
6. R. Huang et al., "Channel-cracking of thin films with the extended finite element method", Engineering Fracture Mechanics, 70. p. 2513-2526 (2003).
7. J.L. Beuth Jr., "Cracking of thin bonded films in residual tension", Int J. Solids and Structures, 29, p. 1657-75, 1991
8. Y. Lin and J.J. Vlassak, Unpublished results, 2005.