An experimental study on molecular dynamics simulation in nanometer grinding

Journal of Materials Processing Technology

Volumn 138, Issue 1-3, 2003, Pages 484-488

  Lin, B ^a   Yu, S Y ^a   Wang, S X ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Mechanism of material removal; Mechanism of surface generation; Molecular dynamics; Nanometer grinding; Simulation experiment

Indexed keywords

ABRASION; CHEMICAL BONDS; COMPUTER SIMULATION; DEFORMATION; MOLECULAR DYNAMICS; STRESS ANALYSIS;

NANOMETER GRINDING;

GRINDING (COMMINUTION);

EID: 0038819008     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(03)00124-9     Document Type: Conference Paper

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