Fine grinding of silicon wafers: A mathematical model for grinding marks

International Journal of Machine Tools and Manufacture

Volumn 43, Issue 15, 2003, Pages 1595-1602

  Chidambaram, S ^a   Pei, Z J ^a   Kassir, S ^b  

^a Sunflower Networking Group   (United States)

^b Strasbaugh Inc   (United States)

Author keywords

Grinding; Machining; Modeling; Semiconductor material; Silicon wafer

Indexed keywords

GRINDING (MACHINING); MATHEMATICAL MODELS; POLISHING; SEMICONDUCTOR MATERIALS;

FINE GRINDING;

SILICON WAFERS;

EID: 0141951884     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0890-6955(03)00187-1     Document Type: Article

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