Flip chip interconnection method applied to small camera module

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1024-1028

  Karasawa, J ^a   Segawa, M ^a   Kishimoto, Y ^a   Aoki, M ^a   Sasaki, T ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; DIGITAL IMAGE STORAGE; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; IMAGE QUALITY; IMAGE SENSORS; SOLDERING;

FLIP CHIP BONDING METHOD; MOBILE INFORMATION DEVICES; PICTURE QUALITY; SMALL CAMERAS;

CAMERAS;

EID: 0034822515     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. A new CCD module using the chip on glass (COG) technique
2. A micro miniaturized CCD color camera utilizing a newly developed CCD packaging technique
3. A new CCD package utilizing the TOG (TAB on glass) bonding technique
4. IK-SM40 super micro camera
5. An ultra small image sensor module for Φ4mm micro camera
6. A small multichip camera module utilizing ACP interconnection method
7. A CMOS image sensor for a digital still camera utilizing the TOG (TAB on glass) bonding
8. Bonding margin evaluation of flip chip bonding method