Resistance characterization of flip chip joint formed using Au bumps and anisotropic conductive adhesives

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 369-375

  Lee, C ^a   Yeo, A ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVES; ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; CONTACT RESISTANCE; ELECTRONICS PACKAGING; FILLERS; FLIP CHIP DEVICES; GLASS BONDING; ITO GLASS; TIN OXIDES;

ANISOTROPIC CONDUCTIVE ADHESIVES; ANISOTROPIC CONDUCTIVE FILMS; ANISOTROPIC CONDUCTIVE PASTES; CONDUCTIVE FILLERS; CONDUCTIVE LINES; FLIP CHIP JOINTS; INDIUM TIN OXIDE; MEASUREMENT METHODS;

GOLD;

EID: 84954038734     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271548     Document Type: Conference Paper

References (10)

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