Improving the reliability of quad flat no-lead packages through test & structural optimization

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 197-204

  Lim, B K ^a   Poh, Francis K S ^a   Chong, Desmond Y R ^a   Koh, S W ^a  

^a NONE

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; MOISTURE; STRESS ANALYSIS;

MOISTURE MODELING; STRESS ENDURANCE WEIGHTAGE (SEW);

ELECTRONICS PACKAGING;

EID: 28444433455     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (18)

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