Study on mobility of water and polymer chain in epoxy for microelectronic applications

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 149-154

  Luo, S ^a   Leisen, J ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Epoxy; Mobility; Solid state NMR; Water absorption; Water diffusion

Indexed keywords

ABSORPTION; DIFFUSION; GLASS TRANSITION; MICROELECTRONICS; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; ORGANIC POLYMERS; POSITRON ANNIHILATION SPECTROSCOPY; TEMPERATURE; WATER;

PLASTICIZING EFFECTS; RUBBERY STATE POLYMER MATRIX; TRANSLATIONAL MOBILITY;

ELECTRONICS PACKAGING;

EID: 0034824972     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Effect of moisture on the curing behavior of underfill
2. Moisture diffusion monitoring in globtop encapsulant with microdielectric sensors
3. Water in epoxy resin part II. Diffusion mechanism
4. Moisture diffusion in epoxy system
5. A discussion of molecular mechanisms of moisture transport in epoxy resin
6. Contributions of the nanovoid structure to the kinetics of moisture transport in epoxy resins
7. Multidimensional solid-state NMR and polymers
8. 2H NMR studies of the non-exponential chain relaxation of polystyrene above the glass transition