Evaluating IC-package interface delamination by considering moisture-induced molding-compound swelling

IEEE Transactions on Components and Packaging Technologies

Volumn 22, Issue 3, 1999, Pages 426-432

  Tanaka, Naotaka ^a   Kitano, Makoto ^a   Kumazawa, Tetsuo ^b   Nishimura, Asao ^a  

^a HITACHI LTD   (Japan)

^b AKITA PREFECTURAL UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); DELAMINATION; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); MOISTURE; RESIDUAL STRESSES; SHEET MOLDING COMPOUNDS; STRESS INTENSITY FACTORS; SWELLING;

ADHESION TEST METHOD;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033320360     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.796546     Document Type: Article

References (12)

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