Characteristics of Cu films prepared using a magnetron sputter type negative ion source (MSNIS)

Applied Surface Science

Volumn 252, Issue 5, 2005, Pages 1812-1817

  Paik, Namwoong ^a  

^a Plasmion Corporation   (United States)

Author keywords

Cu metallization; Negative ion; Trench

Indexed keywords

ION BOMBARDMENT; MAGNETRON SPUTTERING; PROBABILITY; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE ROUGHNESS;

CU FILMS; CU METALLIZATION; NEGATIVE ION;

COPPER;

EID: 27944451491     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.03.204     Document Type: Article

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