Flip chip die cracking - A simplified approach utilizing experimentation and simulations

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 876-883

  Chengalva, M K ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

Assembly systems; Automotive engineering; Consumer products; Control systems; Electronics industry; Flip chip; Manufacturing industries; Residual stresses; Surface cracks; Thermal stresses

Indexed keywords

ASSEMBLY; AUTOMOBILE ELECTRONIC EQUIPMENT; AUTOMOTIVE ENGINEERING; CHIP SCALE PACKAGES; CONSUMER PRODUCTS; CONTROL SYSTEMS; CRACKS; DIES; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; MANUFACTURE; RESIDUAL STRESSES; SURFACE DEFECTS; THERMAL STRESS;

ASSEMBLY SYSTEMS; AUTOMOTIVE ELECTRONICS APPLICATIONS; DIFFERENTIAL THERMAL CONTRACTION; FLIP CHIP; FLIP CHIP ASSEMBLIES; MANUFACTURING INDUSTRIES; RELIABILITY REQUIREMENTS; SURFACE CRACKS;

FLIP CHIP DEVICES;

EID: 84950104376     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012547     Document Type: Conference Paper

References (7)

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3. Popelar, S. F., "An Investigation Into the Fracture of Silicon Die Used in Flip Chip Applications", Proceedings of the 1998 International Symposium on Advanced Packaging Materials, Braselton, GA, March 1998, pp. 41-48.
4. Leung, B., Guo, Y., Sarihan, V., "Die Strength Evaluation in the Presence of Edge Cracks", Proceedings of the 1997 American Society of Mechanical Engineers Conference - Application of Fracture Mechanics in Electronic Packaging, Dallas, TX, Nov. 1997, pp. 125-131.
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6. PATRAN Version 8.0, MacNeal-Schwendler Corp. (www.mscsoftware.com), 2000.
7. Chengalva, M. K., Agarwal, R. K., "Chip Capacitor Cracking Due to Printed Circuit Board Flexure", Experimental/Numerical Mechanics in Electronics Packaging, Volume 1, Society of Experimental Mechanics, pp. 102-107.