Moisture absorption in uncured underfill materials

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 345-351

  Luo, Shijian ^a   Wong, C P ^b  

^a IEEE   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; AGENTS; CATALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; FLIP CHIP DEVICES; GLASS TRANSITION; MOISTURE; ORGANIC ACIDS; THERMODYNAMIC PROPERTIES; WATER ABSORPTION;

METHYLHEXAHYDROPHTHALIC ANHYDRIDE; MOISTURE ABSORPTION; UNDERFILL MATERIALS;

CHIP SCALE PACKAGES;

EID: 3242777745     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828562     Document Type: Article

References (9)

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3. C. P. Wong, S. H. Shi, and G. Jefferson, "High performance no-flow underfills for low cost flip-chip applications: materials characterization," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, p. 360, June 1998.
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9. S. H. Shi and C. P. Wong, "Effect of the complexed moisture in metal acetylacetonate on the properties of the nonflow underfill materials," J. Appl. Polym. Sci., vol. 73, pp. 103-111, 1999.