An investigation of effects of Sb on the intermetallic formation in Sn-3.5Ag-0.7Cu solder joints

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 534-541

  Chen, B L ^a   Li, G Y ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Grain boundary diffusion; Intermetallic growth; Lead free solder; Sb addition

Indexed keywords

ACTIVATION ENERGY; COMPOSITION EFFECTS; CRYSTAL GROWTH; CRYSTAL MICROSTRUCTURE; GRAIN BOUNDARIES; INTERDIFFUSION (SOLIDS); INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; TIN ALLOYS;

GRAIN BOUNDARY DIFFUSION; INTERMETALLIC GROWTH; LEAD FREE SOLDER;

SOLDERING ALLOYS;

EID: 27644537498     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848573     Document Type: Article

References (19)

1. E. P. Wood and K. L. Nimmo, "In search of new lead-free electronic solders," J. Electron. Mater., vol. 23, no. 8, pp. 709-713, 1994.
2. B. Salam, N. N. Ekere, and D. Rajkumar, "Study of the interface microstructure of Sn-Ag-Cu lead-free solders and the effect of solder volume on intermetallic layer formation," in Proc. 51st Electronic Components and Technology Conf., Orlando, FL, May 2001, pp. 471-477.
3. M. R. Harrison, J. H. Vincent, and H. A. H. Steen, "Lead-free reflow soldering for electronics assembly," Soldering & Surface Mount Technol., vol. 13, no. 3, pp. 21-38, 2001.
4. S. Gadag and S. Patra, "Numerical prediction of mechanical properties of Pb-Sn solder alloys containing antimony, bismuth and or silver ternary trace elements," J. Electron. Mater., vol. 29, no. 12, pp. 1392-1397, 2000.
5. T. Y. Lee, W. J. Choi, K. N. Tu, J. W. Jang, S. M. Kuo, and J. K. Lin, "Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn-3.5Ag, Sn-3.8Ag- 0.7Cu and Sn-0.7Cu) on Cu," J. Mater. Res., vol. 17, no. 2, pp. 291-301, 2002.
6. D. R. Frear, J. W. Jang, J. K. Lin, and C. Zhang, "Pb-free solders for flip-chip interconnects," J. Metals, vol. 53, no. 6, pp. 28-32, 2001.
7. Y. G. Lee and J. G. Duh, "Interfacial morphology and concentration profile in the unleaded solder/Cu joint assembly," J. Mater. Sci.: Mater. Electro., vol. 11, pp. 33-43, 2000.
8. M. E. Loomans, S. Vaynman, G. Ghosh, and M. E. Fine, "Investigation of multi-component lead-free solders," J. Electron. Mater., vol. 23, no. 8, pp. 741-746, 1994.
9. Y. Kariya and M. Otsuka, "Mechanical fatigue characteristics of Sn-3.5Ag-X (x = Bi, Cu, Zn, and In) solder alloys," J. Electron. Mater., vol. 27, no. 11, pp. 1229-1235, 1998.
10. N. Wade, K. Wu, J. Kunii, S. Yamada, and K. Miyahara, "Effect of Cu, Ag and Sb on the creep-rupture strength of lead-free solder alloys," J. Electron. Mater., vol. 30, no. 9, pp. 1228-1231, 2001.
11. K. Seelig and D. Suraski, "The status of lead-free solder alloys," in Proc. 50th Electronic Components and Technology Conf., Las Vegas, NV, May 2000, pp. 1406-1409.
12. D. Ohnuma, M. Miyashita, K. Anzai, X. J. Liu, H. Ohani, R. Kainuma, and K. Ishida, "Phase equilibria and the related properties of Sn-Ag-Cu based Pb-free solder alloys," J. Electron. Mater., vol. 29, no. 10, pp. 1137-1144, 2000.
13. D. B. Masson and B. K. Kirkpatrick, "Equilibrium solidification of Sn-Ag-Sb thermal fatigue-resistant solder alloys," J. Electron. Mater., vol. 15, no. 6, pp. 349-353, 1986.
14. P. Villars, A. Prince, and H. Okamoto, Handbook of Ternary Alloy Phase Diagrams. Materials Park, OH: ASM International, 1997.
15. L. Ye, Z. H. Lai, J. Liu, and A. ThoÈleÂn, "Microstructure investigation of Sn-0.5Cu 3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders," Soldering & Surface Mount Technol., vol. 13, no. 3, pp. 16-20, 2001.
16. H. T. Lee, T. L. Liao, M. Hung, and M. Chen, "Study on microstructure and shear strength of Sn-Ag-Sb solder joints," in Proc. 3th Int. Symp. Electronic Materials and Packaging, Jeju Island, Kórea, Nov. 2001, pp. 315-322.
17. J. S. Ha, C. S. Kang, J. Y. Park, and J. P. Jung, "Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate," J. Electron. Mater., vol. 29, no. 10, pp. 1207-1213, 2000.
18. H. K. Kim, H. K. Liou, and K. N. Tu, "Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu," Appl. Phys. Lett., vol. 66, no. 18, pp. 2337-2339, 1995.
19. J. C. M. Li, "Possibility of subgrain rotation during recrystallization," J. Appl. Phys., vol. 33, pp. 2958-2965, 1962.