DBIT - Direct Backside Interconnect Technology: A manufacturable, bond wire free interconnect technology for microwave and millimeter wave MMICs

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 723-726

  Kazior, T E ^a   Atkins, H N ^a   Fatemi, A ^a   Chen, Y ^a   Colomb, F Y ^a   Wendler, J P ^a  

^a RAYTHEON COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; ELECTRIC WIRING; ELECTRONICS PACKAGING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; POLYMERS; SUBSTRATES;

BOND WIRE FREE INTERCONNECT TECHNOLOGY; DIRECT BACKSIDE INTERCONNECT TECHNOLOGY (DBIT); POLYMER BUMPS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0030708120     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)