Novel flip-chip bonding technology for W-band interconnections using alternate lead-free solder bumps

IEEE Microwave and Wireless Components Letters

Volumn 12, Issue 10, 2002, Pages 372-374

  Onodera, Kiyomitsu ^a   Ishii, Takao ^a   Aoyama, Shinji ^a   Sugitani, Suehiro ^a   Tokumitsu, Masami ^a  

^a NTT CORPORATION   (Japan)

Author keywords

Flip chip devices; Lumped element microwave circuits; Microassembly

Indexed keywords

FLIP CHIP DEVICES; GOLD ALLOYS; HEAT TREATMENT; METALLIC FILMS; MICROWAVE CIRCUITS; REACTIVE ION ETCHING; SEMICONDUCTING GALLIUM ARSENIDE; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; WAVEGUIDES;

FLIP CHIP BONDING TECHNOLOGY; FLIP-CHIP-MOUNTED COPLANAR WAVEGUIDE CHIP; LEAD-FREE SOLDER BUMP; MICROASSEMBLY; SOLDER BUMP INTERCONNECTION;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0036807141     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2002.804555     Document Type: Letter

References (7)

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