Deep fused silica wet etching using an Au-free and stress-reduced sputter-deposited Cr hard mask

Journal of Micromechanics and Microengineering

Volumn 15, Issue 11, 2005, Pages 2130-2135

  Steingoetter, Ingo ^a   Fouckhardt, Henning ^a  

^a Rheinland Pfälzische Technische Universität Kaiserslautern Landau   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPRESSIVE STRESS; DEFECTS; FUSED SILICA; MASKS; PRESSURE EFFECTS; SPUTTER DEPOSITION; TENSILE STRESS;

ETCHING DEFECTS; FABRICATION PARAMETERS; STRESS REDUCTION; WET ETCHING;

ETCHING;

EID: 27144446665     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/15/11/019     Document Type: Article

References (29)

1. Schott ML 1998 Datenblatt zu Viosil Quarzglas (Meiningen)
2. Reyes D R, Iossifidis D, Auroux P A and Manz A 2002 Micro total analysis system: 1. Introduction, theory, and technology Anal. Chem. 74 2623-36
3. Auroux P A, Iossifidis D, Reyes D R and Manz A 2002 Micro total analysis system: 2. Analytical standard operations and applications Anal. Chem. 74 2637-52
4. Rossi M, Rudmann H, Maciossek A and Marty B 2004 Wafer-scale micro- and nano-optics fabrication technologies Proc. 10th Microoptics Conference (Jena)
5. http://www.iof.fraunhofer.de/departments/micro-optics/technology/index_e. html
6. Grosse A, Grewe M and Fouckhardt H 2001 Deep wet etching of fused silica glass for hollow capillary optical leaky waveguides in microfluidic devices J. Micromech. Microeng. 11 257-62
7. Chen W, Sugita K, Morikawa Y, Yasunami S, Hayashi T and Uchida T 2001 Application of magnetic neutral loop discharge plasma in deep silica etching J. Vac. Sci. Technol. A 19 2936-40
8. Ceriotti L, Weible K, de Rooij N F and Verpoorte E 2003 Rectangular channels for lab-on-a-chip applications Microelectron. Eng. 67-68 865-71
9. Li L, Abe T and Esashi M 2003 Smooth surface glass etching by deep reactive ion etching with SF6 and Xe gases J. Vac. Sci. Technol. B 21 2545-9
10. Matzke C M, Arnold D W, Ashby C I H, Kravitz S H, Warren M E and Bailey C G 1998 Quartz channel fabrication for electrokinetically driven separations Proc. SPIE 3515 164-71
11. Simpson P C, Woolley A T and Mathies R A 1998 Microfabrication technology for the production of capillary array electrophoresis chips J. Biomed. Microdevices 1 7-26
12. Ilie M, Foglietti V and Cianci E 2002 Deep wet etching of borosilicate glass for microfluidic devices Proc. 7th Italian Conference on Sensors and Microsystems pp 55-9
13. Steingoetter I and Fouckhardt H 2003 Very deep fused silica etching Proc. SPIE 4984 234-43
14. Mourzina Y, Steffen A and Offenhäuser A 2005 The evaporated metal masks for chemical glass etching for BioMEMS Microsyst. Technol. 11 135-40
15. Fouckhardt H, Grosse A, Grewe M and Kuhnke M 2001 Micro flow modules with combined fluid flow channel and optical detection waveguide hyper-Rayleigh scattering as a case study Fresenius J. Anal. Chem. 371 18-27
16. Haefer R A 1987 Oberflächen- und Dünnschicht-Technologie, Teil I (Heidelberg: Springer)
17. Koch C and Rinke T J 2005 Lithographic Processes Manual from MicroChemicalsa®
18. Onyiriuka C E, Kinney L D and Binkowski N J 1997 Adhesion and delamination of tantalum and chromium films on glass J. Adhes. Sci. Technol. 11 929-40
19. Thornton J A and Hoffmann D W 1989 Stress related effects in thin films Thin Solid Films 171 5-31
20. Maissel L I and Glang R 1983 Handbook of Thin Film Technology (New York: McGraw-Hill)
21. Stoney G G 1909 The tension of metallic films deposited by electrolysis Proc. R. Soc. Lond. 69 172-5
22. 2 interface J. Appl. Phys. 37 2429-34
23. www.schott.com/fpd 2005 Flat Panel Display, Schott AG
24. Hoffmann D W and Thornton J A 1977 Internal stresses in sputtered chromium Thin Solid Films 40 355-63
25. Williams K R, Gupta K and Wasilik M 2003 Etch rates for micromachining processing: Part 2 J. Microelectromech. Syst. 12 761-78
26. Verhaverbeke S and Liu L 1999 Generation of point-of-use of BHF Solid State Phenomena 65-66 267-70
27. Moreau W M 1987 Semiconductor Lithography (New York: Plenum)
28. Hedlund C, Lindberg U, Bucht U and Soederkvist J 1993 Anisotropic etching of Z-cut quartz J. Micromech. Microeng. 3 65-73
29. Guilbaud-Massereau V, Celerier A and Machet J 1995 Study and improvement of the adhesion of chromium thin films deposited by magnetron sputtering Thin Solid Films 258 185-93