Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Journal of the Electrochemical Society

Volumn 152, Issue 9, 2005, Pages

  Siau, Sam ^a   Vervaet, Alfons ^a   Schacht, Etienne ^a   Degrande, Siska ^a   Callewaert, Kristof ^a   Van Calster, Andre ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; ELECTROCHEMISTRY; SURFACE ROUGHNESS; SYNTHESIS (CHEMICAL); X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL MODIFICATIONS; CHEMICAL SURFACE SYNTHESIS; EPOXY LAYERS; EPOXY SURFACES;

EPOXY RESINS;

EID: 25644454303     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1952727     Document Type: Article

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