SCOPUS 정보 검색 플랫폼

Journal of Adhesion Science and Technology

Volumn 12, Issue 5, 1998, Pages 541-561

Adhesion improvement of epoxy resin/copper lead frame j oints by azole compounds

(6) Song, S M a Park, C E a Yun, H K b Hwang, C S b Oh, S Y b Park, J M b

a Pohang University of Science and Technology (POSTECH) (South Korea)

b SAMSUNG Electronics (South Korea)

Author keywords

Adhesion strength; Copper; Cu azole complex; Epoxy resin; Polybenzimidazole; Triazole

Indexed keywords

ADHESION IMPROVEMENT; ADHESION PROMOTER; AIR ATMOSPHERE; BENZIMIDAZOLES; BENZOTRIAZOLES; COPPER LEAD FRAMES; COPPER SURFACE; CU-AZOLE COMPLEX; LEAD FRAME; POLYBENZIMIDAZOLE; SURFACE COVERAGES; TREATMENT TEMPERATURE; TREATMENT TIME; TRIAZOLE; UROCANIC ACID;

ADHESION; BOND STRENGTH (MATERIALS); CARBOXYLIC ACIDS; CONTACT ANGLE; COPPER; EPOXY RESINS; NITROGEN COMPOUNDS; OPTICAL MICROSCOPY; RESINS; SCANNING ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY; COPPER ALLOYS; HIGH TEMPERATURE EFFECTS; STRENGTH OF MATERIALS; THERMODYNAMIC STABILITY;

LEAD COMPOUNDS; ADHESIVE JOINTS;

POLYBENZIMIDAZOLE; TRIAZOLE;

EID: 0031697863 PISSN: 01694243 EISSN: 15685616 Source Type: Journal
DOI: 10.1163/156856198X00218 Document Type: Article

Times cited : (31)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.