Evaluation of novel tooling for nanoscale injection molding

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5763, Issue , 2005, Pages 107-116

  Yoon, Sung Hwan ^a   Srirojpinyo, Chinnawat ^a   Lee, Jun S ^a   Mead, Joey L ^a   Matsui, Shinji ^b   Barry, Carol M F ^a  

^a University of Massachusetts   (United States)

^b UNIVERSITY OF HYOGO   (Japan)

Author keywords

Electron beam lithography; Injection molding; Nanoscale replication; Silicon tooling durability

Indexed keywords

COATING TECHNIQUES; ELECTRON BEAM LITHOGRAPHY; NANOSTRUCTURED MATERIALS; POLYCARBONATES; SEMICONDUCTING GALLIUM ARSENIDE; SILICON WAFERS; SURFACE PROPERTIES;

NANOSCALE REPLICATION; SILICON TOOLING DURABILITY; TOOLING MATERIALS;

INJECTION MOLDING;

EID: 25144480909     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.599959     Document Type: Conference Paper

References (26)

1. R. Bashir, "BioMEMS: state-of-the-art in detection, opportunities and prospects." Advanced Drug Delivery Reviews 56(11), 1565-1586, 2004.
2. th IEEE International Conference on Micro Electro Mechanical Systems, 228-231, 1999.
3. Hella-C Scheer, H. Schulz, T. Hoffmann, and C. M. S. Torres, "Nanoimprint techniques".in Handbook of Thin Film Materials, H. S. Nalwa, ed., Academic Press, San Diego, CA, 1-61, 2001.
4. S. Y. Chou, P. R. Krauss, and P. J. Renstrom, "Imprint of sub-25 nm vias and trenches in polymers," Applied Physics Letters, 67, 3114-3116, 1995.
5. H. Becker and L. E. Locascio, "Polymer microfluidic devices," Talanta, 56, 267-287, 2002.
6. R. A. Malloy, Plastics Part Design for Injection Molding, Hanser/Gardner Publications, Cincinnati, OH, 1994.
7. H. Becker and U. Heim, "Hot embossing as a method for the fabricaton of polymer high aspect ratio structures," Sensors and Actuators, 83, 130-135, 2000.
8. L. Weber and W. Ehrfeld, "Molding of microstructures for high-tech-applications,"Proc. Ann. Tech. Conf. Soc. Plast. Eng, 44, 930-934, 1998.
9. D. T. Pham, S. S. Dimov, S. Bigot, A. Ivanov, and K. Popov, "Micro-EDM - recent developments and research issues," Journal of Materials Processing Technology, 149, 50-57, 2004.
10. J. T. Kim, B. C. Kim, M. Y. Jeong, and M. S. Lee, "Fabrication of a micro-optical coupling structure by laser ablation," Journal of Materials Processing Technology, 146, 163-166, 2004.
11. Y. Hirata, "LIGA process - micromachining technique using synchrotron radiation lithography - and some industrial applications," Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms, 208, 21-26, 2003.
12. B. Fay, "Advanced optical lithography development, from UV to EUV," Microelectronic Engineering, 61-62, 11-24, 2002.
13. F. Lehmann, G. Richter, T. Borzenko, V. Hock, G. Schmidt, and L. W. Molenkamp, "Fabrication of sub-10-nm Au-Pd structures using 30 keV electron beam lithography and lift-off," Microelectronic Engineering, 65, 327-333, 2003.
14. K. Ansari, J. A. van Kan, A. A. Bettiol, and F. Watt, "Fabrication of high aspect ratio 100 nm metallic stamps for nanoimprint lithography using proton beam writing." Applied Physics Letters 85(3), 476-478, 2004.
15. L. J. Heyderman, H. Schift, C. David, B. Ketterer, M. A. d. Maur, and J. Gobrecht, "Nanofabrication using hot embossing lithography and electroforming," Microelectronic Engineering, 57-58, 375-380, 2001.
16. D. Grewell, A. Mokhtarzadeh, A. Benatar, C. Lu, and L. J. Lee, "Feasibility of selected methods for embossing micro-features in thermoplastics," Proc. Ann. Tech. Conf. Soc. Plast. Eng, 49, 1094-1098, 2003.
17. D. Grewell, C. Lu, L. J. Lee, and A. Benatar, "Infrared micro-embossing of thermoplastics," Proc. Ann. Tech. Conf. Soc. Plast. Eng, 50, 1231-1235, 2004.
18. Y.-C. Su, J. Shah and L. Lin, "Implementation and analysis of polymeric microstructure replication by micro injection molding," Journal of Micromechanics and Microengineering, 14, 415-422, 2004.
19. L. Yu, C. G. Koh, K. W. Koelling, L. J. Lee, and M. J. Madou, "Experimental and numerical analysis of thin-wall injection molding with micro-features." Proc. Ann. Tech. Conf. Soc. Plast. Eng. 47, 785-789, 2001.
20. A. D'Amore, M. Gabriel, W. Haese, H. Schift, and W. Kaiser, Concentration of Information, 2004.
21. S.-H. Yoon, C. Srirojpinyo, J. Lee, C. Sung, J. L. Mead, and C. M. F. Barry, "The effects of tooling surfaces on injection molded nanofeatures." Proc. Ann. Tech. Conf. Soc. Plast. Eng. 50, 738-742, 2004.
22. C. Srirojpinyo, S.-H. Yoon, J. Lee, C. Sung, J. L. Mead, and C. M. F. Barry, "Effects of materials when injection molding nano-scale features," Proc. Ann. Tech. Conf. Soc. Plast. Eng, 50, 743-747, 2004.
23. E. Tomasetti, R. Legras, B. Henri-Mazeaud, and B. Nysten, "Plastic deformation in polypropylene/(ethylenepropylene) copolymer blend during paint debonding," Polymer. 41, 6597-6602, 2000.
24. F.-B. Li, G. E. Thompson, and R. C. Newman, "Force modulation atomic force microscopy: background, development and application to electrodeposited cerium oxide films," Applied Surface Science, 126, 21-33, 1998.
25. S. M. Sze, High-speed Semiconductor Devices. Wiley-Interscience, Hoboken, NJ, 1990.
26. J. William D. Callister, Materials Science and Engineering An Introduction. John Wiley & Sons, Inc., New York, NY, 1997