The effects of tooling surfaces on injection molded nanofeatures

Annual Technical Conference - ANTEC, Conference Proceedings

Volumn 1, Issue , 2004, Pages 738-742

  Yoon, Sung Hwan ^a   Srirojpinyo, Chinnawat ^a   Lee, Junseok ^b   Sung, Changmo ^b   Mead, Joey L ^a   Barry, Carol M F ^a  

^a University of Massachusetts   (United States)

^b UNIVERSITY OF MASSACHUSETTS LOWELL   (United States)

Author keywords

Nanoinjection molding; Nanoscale features; Silicon wafer tooling

Indexed keywords

NANOINJECTION MOLDING; NANOSCALE FEATURES; SILICON WAFER TOOLING; TOOLING SURFACE;

ATOMIC FORCE MICROSCOPY; COMPRESSION MOLDING; DURABILITY; ELECTRON MICROSCOPES; LASER ABLATION; NANOTECHNOLOGY; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; X RAY LITHOGRAPHY;

INJECTION MOLDING;

EID: 2442594842     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. Martyn, M. T.; Whiteside, B.; Coates, P.D.; Allan, P.S.; Greenway, G.; Hornsby, P; "Micromoulding: Consideration of Processing Effects on Medical Materials", SPE Annual Technical Conference, Nashville, TN, 2003, pp.2582-6.
2. Martyn, M. T.; Whiteside, B.; Coates, P.D.; Allan, P.S.; Hornsby, P. 2002. "Studies of the Process-Property Interaction of the Micromoulding Process", ANTEC 2002-Proceedings of the 60th Annual Technical Conference & Exhibition, San Francisco, CA, May 5-9. Society of Plastics Engineers, pp.
3. H. C. Scheer, H. Schultz, T. Hoffmann, C. M. Sotomayor Torres, Nanoimprint techniques, in: H.S. Nalwa (Ed.), The Handbook of Thin Films, Academic Press, New York, 2001
4. Y. Chou, P.R. Krauss, P. J. Renstrom, Appl. Phys. Lett. 67 (1995) 3114
5. Potsch, G.; Michaeli, W.; Injection molding-An Introduction (1995), pp1
6. Malloy R.; Plastics Part Design for Injection Molding;(1994), pp312
7. Lutz W.; Wolfgang E.; Molding of Microstructures for High-Tech Applications, ANTEC 1998 Volume 3, p930
8. Jatan Shah; Yu-Chuan Su; Liwei Lin. Micro-Electro-Mechanical Systems (1999), 1 235-301
9. Becker, H.; Heim, U.; Silicon as tooling material for polymer hot embossing, IEEE (1999), p229
10. Shen Y. K; Wu W.Y. "An Analysis of the Three-dimensional Micro-Injection Molding". International Communications in Heat and Mass Transfer, 2002, 29(April), Issue 3, 423-31.
11. Grillo, S. E.; Ducarroir, M.; Nadal, M.; Tournie, E.; Faurie, J-P; Nonoindentation of Si, GaP, GaAs and ZnSe single crystals, J. Phys. D:Appl. Phys. 36 (2003) p.L6
12. Ellison, G.N., Thermal Computations for Electronic Equipment, 1984.