Impact of Cu content on the Sn-Ag-Cu interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 113-119

  Lu, Henry Y ^a   Balkan, Haluk ^a   Vrtis, Joan ^a   Ng, K Y Simon ^b  

^a FlipChip International LLC   (United States)

^b Wayne State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACIAL MICROSTRUCTURE; LF INTERCONNECTS; SN-AG-CU INTERCONNECTS; THERMAL CYCLING TEST;

COPPER; ELECTRONICS PACKAGING; SHEAR STRENGTH; SILVER; SOLDERING; THERMAL CYCLING; TIN;

OPTICAL INTERCONNECTS;

EID: 24644497744     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

1. K.W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electronic Materials, vol. 29, (2000), pp. 1122-1136.
2. I. Ohnuma, M. Miyashita, K. Anzai, X.J. Liu, H. Ohtani, R. Kainuma and K. Ishida, J. Electronic Materials, vol. 29, (2000), pp. 1137-1144.
3. D.R. Frear, J.W. Jiang, J.K. Lin and C. Zhang, JOM, vol. 53, (2001), pp. 28-32.
4. nd Electronic Components and Technology Conf, San Diego, CA, May 2002, pp. 1263-1265.
5. rd Electronic Components and Technology Conf, New Orleans, LA, May 2003, pp. 64-70.
6. K.S. Kim, S.H. Huh and K. Suganuma, Materials Science and Engineering A, vol. 333, (2002), pp. 106-114.
7. S.K. Kang, W.K. Choi, D.Y. Shih, D.W. Hendersaon, T. Gosslin, A. Sarkhel, C. Goldsmith and K. Puttlitz, JOM, vol. 55, (2003), pp. 61-65.
8. K.S. Kim, S.H. Huh and K. Suganuma, J. Alloys Comp., vol. 352, (2003), pp. 226-236.
9. H.Y. Lu, D. Lawhead, R. Yazzie, S. Barrett, H. Balkan and J. Vrtis, Semicon Europa 2004, April 19, Munich Germany, (2004).
10. S.K. Kang, P. Lauro, D.Y. Shih, D.W. Henderson, J. Bartelo, T. Gosselin, S.R. Cain, C. Goldsmith, K. Puttlitz, T.K. Hwang and W.K. Choi, Materials Transactions, vol. 45, (2004), pp. 1-8.
11. C.E. Ho, R.Y. Tsai, Y.L. Lin and C.R. Kao, J. Electronic Materials, vol. 31, (2002), pp. 584-590.
12. L.C. Shiau, C.E. Ho and C.R. Kao, Solder and Surface Mount Technology, vol. 14, (2002), pp. 25-29.
13. H.Y. Lu, H. Balkan and K.Y.S. Ng, TMS Anuanl Meeting 2005, accepted.
14. H.Y. Lu, H. Balkan and K.Y.S. Ng, Microelectronics Reliability, submitted.
15. K.Zeng and K.N. Tu, Mater. Sci. Eng. Rep. R38, (2002), pp. 55-105.
16. H.A.H. Steen, Swedish Institute for Metals Research Report No. IM-1643, (1982).
17. J.W. Jang, P.G. Kim, K.N. Tu, D.R. Frear, and P. Thompson, J. Appl. Phys., vol. 85, (1999), pp. 8456-8463.
18. Y.-D. Jeon, K.-W. Paik, K.-S. Bok, W.-S. Choi and C.-L Cho, J. Electronic Materials, vol. 31, (2002), pp. 520-528.
19. rd Electronic Components and Technology Conf, New Orleans, LA, May 2003, pp. 1190-1196.
20. C.-W. Hwang, K. Suganuma, M. Kiso and S. Hashmoto, J. Electronic Materials, vol. 33, (2004), pp. 1200-1209.
21. th Electronic Components and Technology Conf, Las Vagas, NA, May 2004, pp. 675-682.
22. th Electronic Components and Technology Conf, Las Vegas, NV, May 2004, pp. 661-667.
23. S. Terashima, Y. Kariya, T. Hosoi and M. Tanaka, J. Electronic Materials, vol. 32, (2003), pp. 1527-1533.