EUV substrate and blank inspection with confocal microscopy

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5256, Issue 1, 2003, Pages 556-565

  Urbach, Jan Peter ^a   Cavelaars, Jan ^a   Kusunose, Hal ^b   Liang, Ted ^c   Stivers, Alan R ^c  

^a SEMATECH   (United States)

^b Yokohama shi   (Japan)

^c INTEL CORPORATION   (United States)

Author keywords

EUVL; Mask blank inspection; Substrate inspection

Indexed keywords

MASKS; MICROSCOPIC EXAMINATION; MULTILAYERS; PERTURBATION TECHNIQUES; SUBSTRATES; ULTRAVIOLET RADIATION;

MASK BLANK INSPECTION; SUBSTRATE INSPECTION;

LITHOGRAPHY;

EID: 1842422569     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.518388     Document Type: Conference Paper

References (2)

1. A. Stivers, T. Liang, M. Penn, B. Lieberman, G. Shelden, J. Folta, C. Larson, P. Mirkarimi, C. Walton, E. Gullikson, and M. Yi, "Evaluation of the capability of a multibeam confocal inspection system for inspection of euvl mask blanks," 22nd Annual BACUS Symposium on Photomask Technology, 4889, p. 408ff, 2002.
2. A. C. Diebold, ed., Handbook of Silicon Semiconductor Metrology, Marcel Dekker Inc., New York, NY, 2001.